LOCTITE ABLESTIK ABP 6892

LOCTITE ABLESTIK ABP 6892, Die Attach LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability.

• Non-conductive
• Halogen free
• Low viscosity
• Low modulus

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	111.4 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	190.6 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	-25.0 °C
Thixotropic Index	1.75
Viscosity, Brookfield, @ 25.0 °C Speed 0.5 rpm	4100.0 mPa·s (cP)