LOCTITE ABLESTIK ABP 8037TI

LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates.

• High thermal conductivity
• Excellent electrical conductivity
• Excellent adhesive strength
• Stable at high temperatures

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	62.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	10.0 ppm
Extractable Ionic Content, Potassium (K+)	1.0 ppm
Extractable Ionic Content, Sodium (Na+)	20.0 ppm
Hot Die Shear Strength	7.4 kg-f
RT Die Shear Strength	17.6 kg-f
Young's Modulus, @ 250.0 °C	1300.0 N/mm² (188549.0 psi )