LOCTITE ABLESTIK ABP 8060T Így ismerik: ABP 8060T (18G)

LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.

• Thermally conductive
• Hydrophobic
• Stable at high temperatures
• Electrically conductive

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	55.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm