LOCTITE ABLESTIK ABP 8062T Így ismerik: ABP-8062T (17.5g)

LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure LOCTITE® ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. LOCTITE ABLESTIK ABP 8062T highly filled die attach adhesive is suited for small to middle die sizes where thermal and electrical conductivity are needed in a high reliability package.

• Hydrophobic
• Thermally conductive
• Electrically conductive
• Stable at high temperatures

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	100.0 ppm/°C
Cure Type	Heat Cure