LOCTITE ABLESTIK ABP 8064T Így ismerik: ABLESTIK ABP 8064T (44G)

LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.

• High thermal conductivity
• High electrical conductivity
• Medium modulus
• Low outgassing

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	47.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Hot Die Shear Strength	5.6 psi
RT Die Shear Strength	12.18 kg-f
Tensile Modulus, DMTA @ 250.0 °C	1280.0 N/mm² (185505.0 psi )