LOCTITE ABLESTIK DX20C Így ismerik: ECCOBOND DX-20C 0.03KG

LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing. LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.

• One component
• No yellowing
• Excellent adhesion
• Long work life

Applications	Die Attach
Cure Type	Heat Cure
Hot Die Shear Strength	5.0 kg-f
Key Characteristics	Conductivity: Electrically Non-Conductive
RT Die Shear Strength	12.8 kg-f
Thixotropic Index	4.2
Viscosity, Cone & Plate, @ 25.0 °C Speed 10 rpm	12000.0 mPa·s (cP)