Application Method |
Dispense System |
Applications |
Die Attach |
Color |
Gray |
Cure Type |
Heat Cure |
Extractable Ionic Content, Chloride (CI-) |
30.0 ppm |
Extractable Ionic Content, Potassium (K+) |
5.0 ppm |
Extractable Ionic Content, Sodium (Na+) |
5.0 ppm |
Key Characteristics |
Conductivity: Electrically Conductive, Modulus: High Modulus |
Number of Components |
1 Part |
Physical Form |
Paste |
Substrates |
LeadFrame: Gold, LeadFrame: Silver |
Technology |
Epoxy |
Tensile Modulus, @ 250.0 °C |
720.0 N/mm² (105000.0 psi ) |
Thixotropic Index |
4.8 |