LOCTITE ABLESTIK QMI519

LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes. LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.

• Thermal conductivity: 3.8 W/m-K
• Electrically conductive
• Ease of use
• Stable at high temperatures

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	40.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	20.0 ppm
Extractable Ionic Content, Fluoride (F-)	20.0 ppm
Extractable Ionic Content, Potassium (K+)	20.0 ppm
Extractable Ionic Content, Sodium (Na+)	20.0 ppm
RT Die Shear Strength	59.0 kg-f
Young's Modulus, @ 25.0 °C	5300.0 N/mm² (769000.0 psi )