LOCTITE ABLESTIK QMI519LB Így ismerik: QMI519LB (20G)

LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.

• Ease of use
• Low resin bleed
• Electrically conductive
• Thermally conductive

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	40.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	19.0 ppm
Extractable Ionic Content, Potassium (K+)	19.0 ppm
Extractable Ionic Content, Sodium (Na+)	19.0 ppm
RT Die Shear Strength, 2 x 2 mm Si die on Au leadframe	15.0 kg-f