LOCTITE ABLESTIK QMI536

LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive LOCTITE® ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. This material is hydrophobic and stable at high temperatures. These features produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, and Au. The adhesive also has excellent dielectric properties. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap cure oven, or utilize Skip Cure processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process. Please refer to the TDS for alternate cure times.

• One component - requires no mixing
• Stable at high temperatures
• Hydrophobic
• Excellent interfacial adhesive strength

Application Method	Dispense System
Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	98.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	174.0 ppm/°C
Color	White
Cure Type	Heat Cure
Density, Maximum Final	1.3 g/cm³
Extractable Ionic Content, Chloride (CI-)	20.0 ppm
Extractable Ionic Content, Fluoride (F-)	20.0 ppm
Extractable Ionic Content, Potassium (K+)	20.0 ppm
Extractable Ionic Content, Sodium (Na+)	20.0 ppm
Glass Transition Temperature (Tg)	-31.0 °C
Key Characteristics	Adhesion: Good Adhesion, Alpha Emissions: Ultra Low Alpha Emissions, Cure Speed: Very Fast, Dielectric, Dispensibility: Good Dispensibility, Lead Free Process Compatible, Modulus: Low Modulus, Stress: Low Stress
Modulus, DMA @ 25.0 °C	0.3 GPa (300.0 N/mm² , 43500.0 psi )
Number of Components	1 Part
Physical Form	Paste
RT Die Shear Strength, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe	17.0 kg-f
Substrates	Laminate, Polyimide
Thermal Conductivity	0.3 W/mK
Thixotropic Index	5.7
Viscosity	8500.0 mPa·s (cP)