LOCTITE ABLESTIK QMI536NB

LOCTITE ABLESTIK QMI536NB, Bismaleimide Resin, Die Attach, Low Bleed Non-conductive, PTFE-filled Paste LOCTITE® ABLESTIK QMI536NB is a low bleed non conductive, PTFE-filled paste designed for stacked die applications which require very low stress and robust mechanical properties. The material has the same processing and properties of QMI536 but resin bleed is essentially eliminated. These features produce fast cure capability and enhanced reliability performance to a wide variety of surfaces, including solder resist, flexible tape, bare silicon and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning after multiple exposures to lead-free solder reflow temperatures.

• Stacked die application
• High resistance
• Low bleed

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	80.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	150.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	19.0 ppm
Extractable Ionic Content, Fluoride (F-)	19.0 ppm
Extractable Ionic Content, Potassium (K+)	19.0 ppm
Extractable Ionic Content, Sodium (Na+)	19.0 ppm
Glass Transition Temperature (Tg)	-30.0 °C
Hot Die Shear Strength	15.0 kg-f
Substrates	Laminate, Polyimide
Technology	Hybrid Chemistry
Thixotropic Index	5.0
Viscosity	10000.0 mPa·s (cP)