LOCTITE ABLESTIK QMI546

LOCTITE ABLESTIK QMI546, BMI, Die attach LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives

• Non-conductive
• Stable at high temperatures
• Hydrophobic
• Void-free bondline

Applications	Die Attach
Coefficient of Thermal Expansion (CTE), Above Tg	190.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	80.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	10.0 °C
Thermal Conductivity	0.2 W/mK
Thixotropic Index	6.0
Viscosity	6500.0 mPa·s (cP)