LOCTITE ABLESTIK 2030SCM

LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.

• Snap curable
• Low stress

Applications	Die Attach
Cure Type	Heat Cure
Thermal Conductivity	2.3 W/mK
Thixotropic Index	4.6
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	14000.0 mPa·s (cP)