LOCTITE ABLESTIK 2958

LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing LOCTITE® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications that require superior electrical and mechanical properties. It is free of contaminating solvents and additives and develops strong durable seals and coatings.

• Thermally conductive
• Snap curable
• Electrically conductive
• Long pot life

Cure Schedule, @ 125.0 °C	5.0 min.
Cure Type	Heat Cure
Number of Components	2 Part
Operating Temperature	-60.0 - 175.0 °C
Shear Strength, Aluminum	1000.0 psi
Storage Temperature	27.0 °C
Technology	Epoxy
Thixotropic Index	2.9
Volume Resistivity, 2 min. @ 150°C	0.0005 Ohm cm
Volume Resistivity, 5 min. @ 125 °C	0.0003 Ohm cm
Mixed
Viscosity, Mixed @ 25.0 °C	40000.0 mPa·s (cP)