LOCTITE ABLESTIK 3290P

LOCTITE ABLESTIK 3290P, Epoxy, Die Attach LOCTITE® ABLESTIK 3290P electrically conductive die attach adhesive is designed for high reliability package applications. This material is the higher modulus version of 3290 adhesive.

• Medium modulus
• Snap curable
• Low outgassing
• Conductive

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	68.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	101.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	136.0 °C
Thixotropic Index	3.5
Viscosity, Cone & Plate, @ 25.0 °C Speed 5 rpm	12000.0 mPa·s (cP)