LOCTITE ABLESTIK 8352L-G

LOCTITE ABLESTIK 8352L-G, Epoxy, Die Attach LOCTITE® ABLESTIK 8352L-G die attach adhesive is designed for high reliability packaging applications. This product is particularly suitable for packages in which tight control of resin bleed out or kerf creep is required.

• Electrically conductive
• Low stress
• Use for wide range of package sizes
• Excellent adhesion to copper

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	76.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	191.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	31.0 °C
Thixotropic Index	5.7
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	9430.0 mPa·s (cP)