LOCTITE ABLESTIK 8601S25

LOCTITE ABLESTIK 8601S25, Epoxy, Die Attach LOCTITE® ABLESTIK 8601S25 die attach adhesive has been formulated for use in high throughput die attach applications

• Snap curable
• Low outgassing
• Conductive
• Medium modulus

Applications	Die Attach
Cure Type	Heat Cure
Thixotropic Index	5.6
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	7200.0 mPa·s (cP)