LOCTITE ABLESTIK ABL 2100A

LOCTITE ABLESTIK ABL 2100A, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.

• Ultra-low moisture absorption
• Pb-free applications
• High hot/wet adhesion
• Excellent dispensing characteristics

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	65.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	200.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	60.0 °C
Thermal Conductivity	1.2 W/mK
Thixotropic Index	5.3
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	9000.0 mPa·s (cP)