LOCTITE ABLESTIK ABP 2030SCR

LOCTITE ABLESTIK ABP 2030SCR, Proprietary Hybrid Chemistry, Die Attach, Conductive Adhesive LOCTITE® ABLESTIK ABP 2030SCR conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.

• Low stress
• Low moisture uptake
• Solvent-free
• Low halogen content

Applications	Die Attach
Cure Type	Heat Cure
Thermal Conductivity	2.0 W/mK
Thixotropic Index	5.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	15000.0 mPa·s (cP)