LOCTITE ABLESTIK ABP 8065T

LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.

• Medium to high thermal conductivity
• No channel void issue
• High die shear strength
• High electrical conductivity

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	40.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	146.0 ppm/°C
Cure Type	Heat Cure
Thermal Conductivity	10.0 W/mK
Thixotropic Index	6.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	9000.0 mPa·s (cP)