LOCTITE ABLESTIK ABP 8066T

LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive LOCTITE® ABLESTIK ABP 8066T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. The material is hydrophobic and stable at high temperatures. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.

• High thermal conductivity
• High electrical conductivity
• High die shear strength
• Long open time

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	53.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	90.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	67.0 °C
Thermal Conductivity	15.0 W/mK
Thixotropic Index	6.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	10000.0 mPa·s (cP)