LOCTITE ABLESTIK ABP 8068TB

LOCTITE ABLESTIK ABP 8068TB, Silver-filled, Semi-sintering, Semiconductor, Conductive adhesive LOCTITE® ABLESTIK ABP 8068TB is a silver-filled semi-sintering die attach adhesive designed for semiconductor packages with high thermal and electrical requirements. It is formulated with a more enhanced resin bleed control than its predecessor LOCTITE ABLESTIK ABP 8068TA. LOCTITE ABLESTIK ABP 8068TB is designed to provide high adhesion and low stress which are essential for the thermal and reliability performances of high end power packages. The thermal performance of this material is comparable to that of a solder paste product.

• No resin bleed-out
• Good workability
• Good sintering properties when used on Ag, PPF, Au and Cu substrates
• One component

Coefficient of Thermal Expansion (CTE)	25.0 ppm/°C
Cure Type	Heat Cure
Thixotropic Index	5.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	11500.0 mPa·s (cP)