LOCTITE ABLESTIK ICP 3850
LOCTITE ABLESTIK ICP 3850, Epoxy, Assembly, Electrically Conductive Adhesive
LOCTITE® ABLESTIK ICP 3850 electrically conductive adhesive is designed as a Pb-free alternative to solder. The rheology of LOCTITE ABLESTIK ICP 3850 adhesive is optimized for high speed dispensing in the assembly of mounting small LEDs onto flexible substrate.
- Pb-free alternative to solder
- Low temperature cure
- Electrically conductive
- Low halogen content
Cure Schedule, @ 120.0 °C |
30.0 min. |
Cure Type |
Heat Cure |
Number of Components |
1 Part |
Storage Temperature |
-40.0 °C |
Technology |
Epoxy |
Thixotropic Index |
5.0 |
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm |
8000.0 mPa·s (cP) |
Volume Resistivity |
0.001 Ohm cm |