LOCTITE ABLESTIK QMI509

LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. This adhesive also exhibits a very low modulus, which can reduce inter-package stress. A package or device manufactured with LOCTITE ABLESTIK QMI509 will have good resistance to delamination and “popcorning” after exposure to reflow temperatures. LOCTITE ABLESTIK QMI509 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure™ processing on a die bonder or wire bonder.

• Electrically conductive
• Stable at high temperatures
• Void-free bondline
• Hydrophobic

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	77.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	168.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	1.0 °C
Thermal Conductivity	2.8 W/mK
Thixotropic Index	3.5
Viscosity	8500.0 mPa·s (cP)