LOCTITE ABLESTIK QMI529HT-2A1

LOCTITE ABLESTIK QMI529HT-2A1, BMI/Acrylate, Die attach LOCTITE® ABLESTIK QMI529HT-2A1 conductive die attach adhesive has been formulated for use in high throughput die attach applications. A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.

• Electrically conductive
• Void-free bondline
• Thermally conductive
• Hydrophobic

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	53.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	156.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	3.0 °C
Thermal Conductivity	6.0 W/mK
Thixotropic Index	4.8
Viscosity	185000.0 mPa·s (cP)