LOCTITE ECCOBOND E 3200

LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.

• Fast and low temperature cure
• Resilient
• Sag resistant paste
• Flexible epoxy

Cure Schedule, @ 100.0 °C	20.0 min.
Viscosity, Brookfield, Speed 10 rpm	150000.0 mPa·s (cP)