LOCTITE 3609

Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.

• Particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required
• Designed for bonding surface mounted devices to printed circuit boards prior to wave soldering
• One component - requires no mixing
• Can be used in lead free wave solder with both water-based and alcohol-based fluxes

Color	Red
Cure Type	Heat Cure
Number of Components	1 Part
Physical Form	Gel
Shear Strength, Steel (grit blasted)	1450.0 psi
Storage Temperature	2.0 - 8.0 °C
Technology	Epoxy
Viscosity, Cone & Plate Haake PK100, M10/PK1, 2°	0.16 - 20.0 Pa∙s