LOCTITE 3611

LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive LOCTITE® 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.

• One component - requires no mixing
• Very high wet strength

Casson Viscosity, Cone & Plate Haake PK100, M10/PK1, 2°	20.0 - 50.0 Pa∙s
Cure Schedule, @ 150.0 °C	90.0 - 120.0 sec.
Cure Type	Heat Cure
Number of Components	1 Part
Physical Form	Gel
Shear Strength, Steel (grit blasted)	2175.0 psi
Storage Temperature	2.0 - 8.0 °C
Technology	Epoxy