LOCTITE 3619

LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.

• One component
• High dispense speed
• High wet strength

Casson Viscosity, Cone & Plate Haake PK100, M10/PK1, 2°, @ 25.0 °C	1.0 - 4.0 Pa∙s
Cure Schedule, @ 100.0 °C	30.0 min.
Cure Type	Heat Cure
Number of Components	1 Part
Physical Form	Paste
Shear Strength, Steel (grit blasted)	2030.0 psi
Storage Temperature	2.0 - 8.0 °C
Technology	Epoxy