LOCTITE 3621 Így ismerik: Chipbonder 3621

LOCTITE 3621, Epoxy, Surface mount adhesive LOCTITE® 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. LOCTITE 3621 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.

• One component - requires no mixing
• Very high dispense speed
• High wet strength

Casson Viscosity, Cone & Plate Haake PK100, M10/PK1, 2°, @ 25.0 °C	0.5 - 3.0 Pa∙s
Coefficient of Thermal Expansion (CTE), Above Tg	100.0 ppm/°C
Cure Schedule, @ 150.0 °C	90.0 - 120.0 sec.
Cure Type	Heat Cure
Number of Components	1 Part
Physical Form	Gel
Shear Strength, Steel (grit blasted)	2175.0 psi
Storage Temperature	2.0 - 8.0 °C
Technology	Epoxy
Yield Point, Cone & Plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C	130.0 - 280.0 Pa∙s