LOCTITE ABLESTIK 2112 BIPAX

LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications.

• Two component
• Thixotropic
• Non-sag
• Solvent-free

Cure Schedule, Recommended @ 65.0 °C	4.0 hr.
Cure Type	Heat Cure
Number of Components	2 Part
Shear Strength, Aluminum	1900.0 psi
Storage Temperature	27.0 °C
Substrates	Metal
Technology	Epoxy
Thixotropic Index	6.5
Viscosity, Brookfield, Spindle RV7, Speed 10 rpm	60000.0 mPa·s (cP)