LOCTITE ABLESTIK 3119

LOCTITE ABLESTIK 3119, Epoxy, Bonding LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. Please refer to the TDS for alternate cure schedules.

• One component - requires no mixing
• High speed curing at low temperature
• Excellent adhesion

Cure Type	Heat Cure
Glass Transition Temperature (Tg)	110.0 °C