LOCTITE ABLESTIK 8-2

LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.

• One component - requires no mixing
• Positive under UV light

Applications	Die Attach
Cure Schedule, @ 95.0 °C	1.5 hr.
Number of Components	1 Part
Shear Strength, Aluminum	2300.0 psi
Storage Temperature	-40.0 - 25.0 °C
Technology	Epoxy