LOCTITE ABLESTIK 816H01

LOCTITE ABLESTIK 816H01, Epoxy, Component assembly, Non-conductive adhesive LOCTITE® ABLESTIK 816H01 adhesive is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This adhesive develops strong, durable, high-impact bonds at room temperature which improves heat transfer while maintaining electrical isolation. LOCTITE ABLESTIK 816H01 bonds offer resistance to salt solutions, mild acids and alkalis, petroleum solvents, lubricating oils and other chemicals.

• Electrically Insulating
• Thermally conductive : 2.0 W/m-K
• Thixotropic

Number of Components

1 Part