LOCTITE ABLESTIK 84-3MV

LOCTITE ABLESTIK 84-3MV, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3MV adhesive is designed for medium die attach applications. This adhesive is ideal for application by stamping or dispensing. Please refer to the TDS for alternate cure schedules.

• Electrically Insulating
• Low viscosity
• Non-conductive

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	40.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	110.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	70.0 °C
Thermal Conductivity	0.5 W/mK
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	29000.0 mPa·s (cP)