LOCTITE ABLESTIK A329-1

LOCTITE ABLESTIK A329-1, Epoxy, Assembly LOCTITE® ABLESTIK A329-1 adhesive is designed for insulating applications. It is made thixotropic to prevent sag during heat cure. LOCTITE ABLESTIK A329-1J bonds offer resistance to water, freon, solvents, acids and strong bases.

• Thixotropic
• Non-conductive
• One component, requires no mixing
• Sag resistant

Cure Schedule, @ 120.0 °C	30.0 min.
Cure Type	Heat Cure
Number of Components	1 Part
Shear Strength, Aluminum	2700.0 psi
Storage Temperature	0.0 - 8.0 °C
Substrates	Fiberglass Reinforced Plastic (FRP)
Technology	Epoxy
Viscosity, @ 25.0 °C	330000.0 mPa·s (cP)