LOCTITE ABLESTIK ABP 2040LV

LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 2040LV non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and decrease warpage between dissimilar surfaces.

• Non-conductive
• Single component
• Fast cure
• Low temperature cure

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	39.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	129.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	28.0 °C
Thermal Conductivity	0.4 W/mK
Thixotropic Index	5.1
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	11000.0 mPa·s (cP)