LOCTITE ABLESTIK ABP 8151D7

LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8151D7 non-conductive die attach adhesive is designed for MEMs package applications.

• Electrically non-conductive
• Low modulus
• Low temperature cure

Applications	Die Attach
Cure Type	Heat Cure
Thixotropic Index	3.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	12000.0 mPa·s (cP)