Product details from catalogue Inquiry

Drawings:

LOCTITE ABLESTIK ABP 8163F-1

LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications
  • High reflectivity
  • Excellent anti-yellowing properties
  • High thermal conductivity

Applications Die Attach
Cure Type Heat Cure
Thermal Conductivity 0.8 W/mK
Thixotropic Index 5.2
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 21000.0 mPa·s (cP)