LOCTITE ABLESTIK ABP 84-3JT

LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.

• Non-conductive
• Insulating
• No resin bleed-out
• Good adhesion to Cu and Ag

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	36.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	117.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	56.0 °C
Thermal Conductivity	0.6 W/mK
Thixotropic Index	4.4
Viscosity, Brookfield, @ 25.0 °C Speed 5 rpm	10900.0 mPa·s (cP)