LOCTITE ABLESTIK ABP 8420

LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring.

• Non-conductive
• Excellent resin bleed out (RBO) performance
• Fast cure
• Black pigmentation for blocking stray light

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	54.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	154.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	75.0 °C
Thermal Conductivity	0.3 W/mK
Thixotropic Index	5.8
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	13500.0 mPa·s (cP)