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LOCTITE ABLESTIK QMI538NB

LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure schedules.
  • Non-conductive
  • Low viscosity
  • Reduced resin bleed
  • Hydrophobic

Applications Die Attach
Coefficient of Thermal Expansion (CTE) 59.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg 130.0 ppm/°C
Cure Type Heat Cure
Extractable Ionic Content, Chloride (CI-) 19.0 ppm
Extractable Ionic Content, Fluoride (F-) 19.0 ppm
Extractable Ionic Content, Potassium (K+) 19.0 ppm
Extractable Ionic Content, Sodium (Na+) 19.0 ppm
Glass Transition Temperature (Tg) -70.0 °C
Hot Die Shear Strength 15.0 kg-f
Storage Temperature -40.0 °C
Tensile Modulus, @ 25.0 °C 100.0 N/mm² (14500.0 psi )
Thixotropic Index 5.0
Viscosity, @ 25.0 °C 8200.0 mPa·s (cP)