LOCTITE ECCOBOND BF 4

LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond. LOCTITE® ECCOBOND BF 4 is a low moisture, die attach adhesive that combines light cure AA50T and BF -4 to provide reliable alignment and raised ability to withstand temperature and humidity changes. The material offers good adhesion to plastic and low outgassing.

• Non-Conductive
• Low Moisture (vapour sorption)
• High Tg
• Good adhesion to plastics

Applications	Die Attach
Color	Black
Cure Schedule, @ 100.0 °C	30.0 min.
Glass Transition Temperature (Tg)	94.0 °C
Number of Components	1 Part
Shear Strength	24.0 kg-f
Storage Temperature	-40.0 °C
Technology	Epoxy
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	23500.0 mPa·s (cP)