LOCTITE ECCOBOND DP 1006

LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications.

• One component
• Non-conductive
• Extremely flexible
• Fast cure

Applications	Die Attach, Encapsulating
Coefficient of Thermal Expansion (CTE), Above Tg	220.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	50.0 ppm/°C
Color	Light Yellow
Cure Schedule, Recommended @ 140.0 °C	2.0 sec.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	27.0 °C
Storage Temperature	-20.0 °C
Viscosity, Brookfield, @ 25.0 °C Speed 5 rpm	65000.0 mPa·s (cP)