LOCTITE ECCOBOND DS 3318BLX

LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation LOCTITE® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key characteristic of this material, enabling stress absorption and providing extra protection from cracking in functional testing.

• High flexibility
• Fast cure
• Moderate modulus
• Reworkable

Applications	Encapsulating
Color	Blue
Cure Type	UV Cure
Elongation, at break	250.0 %
Glass Transition Temperature (Tg)	68.0 °C
Storage Modulus, @ 25.0 °C	510.0 MPa
Storage Temperature	25.0 °C
Technology	Acrylic
Viscosity, Cone 20 mm, Angle 2° @ 25.0 °C Spindle TA, Shear Rate 15 s⁻¹	2050.0 mPa·s (cP)