LOCTITE ECCOBOND E 3230

LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.

• Sag resistant paste
• Fast and low temperature cure
• Resilient
• Long pot life

Casson Viscosity, @ 25.0 °C Shear Rate 10 s⁻¹	45200.0 mPa·s (cP)
Cure Schedule, @ 100.0 °C	20.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	58.0 °C
Storage Temperature	-20.0 °C
Thixotropic Index	1.6