LOCTITE ECCOBOND EN 3707F

LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.

• Dual cure
• Fast UV cure
• Cures in shadowed areas with heat
• Easy dispensability without stringing

Applications	Encapsulating
Coefficient of Thermal Expansion (CTE), Above Tg	162.2 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	50.3 ppm/°C
Color	Light Blue
Cure Schedule Light Intensity	100.0 mW/cm²
Cure Schedule, @ 100.0 °C	5.0 min.
Cure Schedule, @ 130.0 °C	1.0 - 2.0 min.
Cure Schedule, @ 80.0 °C	30.0 min.
Cure Type	UV Cure
Depth of Cure	10.0 mm
Glass Transition Temperature (Tg)	37.0 °C
Shelf Life	180.0 day
Shore Hardness, Shore D	27.0
Storage Modulus, DMA @ 25.0 °C	4400.0 N/mm² (638000.0 psi )
Storage Temperature	-20.0 °C
Technology	Acrylic
Thixotropic Index	4.1
Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm	3480.0 mPa·s (cP)