LOCTITE ECCOBOND EN 3838T

LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.

• Thixotropic
• Fast cure at moderate temperatures
• Low modulus
• Low Tg

Coefficient of Thermal Expansion (CTE), Above Tg	217.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	57.0 ppm/°C
Cure Schedule, @ 130.0 °C	8.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	2.0 °C
Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm	6700.0 mPa·s (cP)