LOCTITE ECCOBOND EN 3860T

LOCTITE ECCOBOND EN 3860T, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 3860T is a CSP/BGA encapsulant formulated to have low viscosity and good flow performance. LOCTITE ECCOBOND EN 3860T encapsulant cures quickly at low temperature to minimize thermal stress to other components and provide rapid device throughput.

• One component
• Fast flow
• Halogen free
• Low viscosity

Coefficient of Thermal Expansion (CTE), Above Tg	217.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	57.0 ppm/°C
Cure Schedule, @ 130.0 °C	10.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	82.0 °C
Viscosity	1000.0 mPa·s (cP)