LOCTITE ECCOBOND FP0087

LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices. LOCTITE® ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking.The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.

• Single component
• Excellent thermal shock resistance
• Excellent moisture resistance
• High glass transition

Applications	Encapsulating
Coefficient of Thermal Expansion (CTE), Below Tg	18.0 ppm/°C
Color	Black
Cure Type	Heat Cure
Number of Components	1 Part
Shelf Life	9.0 mon.
Shore Hardness, Shore D	95.0
Technology	Epoxy
Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 20 rpm	20000.0 mPa·s (cP)